Manufacturer for Mold Components - OEM extrusion machined heat sink with fan for cooling solution – Yaotai

A heat sink and fan also called HSF, is an active cooling solution used to cool down integrated circuits in computer systems, commonly the central processing unit (CPU). As the name suggests, it is composed of a passive cooling unit (the heat sink) and a fan. The heat sink is usually made from a high-temperature conductive material such as aluminum and copper, and the fan is a DC brushless fan, which is the standard used for computer systems.
Nearly all computers have heat sinks, which help keep the CPU cool and prevent it from overheating. But sometimes the heat sink itself can become too hot. This can happen if the CPU is running at full capacity for an extended period of time or if the air surrounding the computer is simply too hot.
Therefore, a fan is often used in combination with the heat sink to keep both the CPU and heat sink at an acceptable temperature. The fan moves cool air across the heat sink, pushing hot air away from the computer. Each CPU has a thermometer built in that keeps track of the processor’s temperature. If the temperature becomes to hot, the fan or fans near the CPU may speed up to help cool the processor and heat sink.
Yaotai is the OEM manufacturer has offered HSF for our customers who are from North America and Europe. Tell us your requests, we will offer our best solutions to you.